PCBA/PCBA detection

1. PCBA testing

Appearance inspection

U slice analysis

Observation of u PCB differential layer

Scanning electron microscope/X-ray energy spectrometer (SEM/EDS)

u FT-IR

U X-ray fluoroscopy

U Solder joint strength (tensile, shear)

U Tin ball thrust

U staining test

U Coating thickness (slicing method)

Reliability analysis of u PCBA solder joints

U Coating thickness (X-ray)

Observation of tin whiskers (normal temperature and humidity)

Observation of tin whiskers (high temperature and humidity)

Observation of tin whiskers (temperature cycling)

Observation of tin whiskers (SEM inspection)

2. PCB testing

U Thermal conductivity/thermal resistance

U coefficient of thermal expansion

U Glass transition temperature

U Thermal cracking temperature

U Explosion time T260/T288

Flame retardant test (plastic, PCB substrate)

Visual inspection

U size measurement

U Micro size inspection

Measurement of u hole size

Measurement of dimensions of u hole metal coating

U pinhole evaluation, dye penetration method

U PCB slice analysis, layered inspection

U warpage

U (using standard platform, sheet gauge)

U bending strength

U (Copper Clad Laminate)

U bending strength

U (rigid insulation laminate)

U Peel strength test

U (copper clad plate, PCB)

U pull-off strength

Tensile strength and elongation of copper foil

U Coating adhesion

U (tape test)

U withstand voltage

U breakdown voltage

U Insulation resistance

U Insulation resistance and moisture resistance

U interconnect resistance

U Surface/Volume Resistivity

Change in resistance of u metallized holes

U dielectric constant

U dielectric loss factor

U Cleanliness (ion contamination) test

Hygroscopicity

U CAF testing

Sample pretreatment

U Solderability

U thermal stress

U Thermal stress - plating through-hole

U (plated hole)

U Thermal stress - Laminate

3. Failure Analysis of PCB&PCBA

U PCB (printed circuit board): blistering on the board surface, explosive delamination, solder mask, solder pad detachment, migration, corrosion, discoloration, leakage, short circuit, open circuit on the board surface

U PCBA (assembled circuit board): welding problems, poor soldering, abnormal detachment of components, faulty soldering, leakage or short circuit, open circuit

BGA, connector assembly issue: poor welding